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SiGlaz Announces the Release of SiGlaz Defect Navigator
Inotera Accepts SiGlaz Intelligent Defect Analysis Software
Winbond Accepts SiGlaz Intelligent Defect Analysis Software
SiGlaz Integrates Spatial Signature Analysis software with MES
SiGlaz recognized by Microsoft as a Certified Partner
SiGlaz IDA Software Release 8.4 improves accuracy and ease-of-use
SiGlaz’s Intelligent Defect Analysis for Spatial Signature Analysis Adopted by UMC
SiGlaz Signs Rep Agreement with Scientech
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SiGlaz offers a low-cost application for analysis of wafer defect data;
the software targets companies with low-to-medium production volumes |
SANTA CLARA, CA, July 23, 2010 – SiGlaz, a leading provider of spatial signature analysis software to the semiconductor and hard disk drive industry, announced the release of a new software product that meets the defect and yield analysis needs of semiconductor fabs with low-to-medium production volumes. SiGlaz Defect Navigator, Professional Edition (SDN – P), provides the yield engineer with a range of functions to review and display standard data files generated by inline inspection and review systems.
In targeting the data analysis needs of smaller companies, John Poreda, SiGlaz Vice President of Sales and Marketing, said “Many companies have been relying upon in-house software tools with limited functionality to manage and analyze their inspection data. SDN now gives these companies an economical way to upgrade their data management and analysis capability.”
SiGlaz Defect Navigator operates on a Windows-based PC (Windows XP or Windows 7), using .NET Framework 3.5. It contains an internal SQL ExpressTM database that allows the user to store up to 4 GBytes of defect inspection data. The software will continuously monitor a designated folder for incoming data files and automatically load the new files to the database. The user may query the database by multiple attributes from the inspection file (e.g., Lot ID, Device ID and Step ID) to create a data set.
SDN allows the user to configure the user interface to optimally view the data output. The user may simultaneously display multiple windows containing a stacked wafer map, a histogram, a thumbnail wafer gallery, a defect list or other important information. Stacked wafer map analysis provides a wafer map display containing all defects in the selected data set. The defects are color coded by various user-defined attributes and synchronized with the histogram. SDN drill down and drill across analysis functions allow the user to graphically select any bar on the histogram and create a new chart comprised of only the selected data. Defect Adder Analysis (DAA) allows the user to analyze and display how successive processing steps add or remove defects from the data set.
Poreda also noted that SiGlaz plans to continue to expand the functionality of SDN, adding optional plug-in modules; for example a scratch analyzer, a zonal analyzer and a repeater analyzer. He also noted that SDN could be customized to add work-in-process data (e.g., equipment process chamber) to the wafer record in the database so that the root cause process issues could be identified more easily. |
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SANTA
CLARA, CA, May 11, 2008 - C SiGlaz, a
world leader in defect spatial signature
analysis (SSA) software, today announced
that Inotera Memories, Inc, a leading
memory manufacturer in Taiwan, has installed
and accepted SiGlaz Intelligent Defect
Analysis (IDA) software system. IDA software
automatically analyzes the spatial distribution
of defects on the wafer, using its patented
algorithms, and notifies the user when
it recognizes a signature. Defect spatial
signatures may result from process excursions
or from failures in process equipment.
At Inotera, IDA is playing
a key role in process optimization and
yield improvement. With the Defect Signature
Analyzer application, Inotera engineers
can develop custom signature libraries,
as well as analysis and reporting recipes
that will characterize a targeted production
process step. As changes are made to the
process, IDA will automatically monitor
the results and precisely identify the
number of occurrences of each signature
type. As the process is improved, the
number of signatures occurrences decreases.
Inotera has found that
the flexibility of IDA to create new signature
types is a major advantage over other
SSA products. According to Daniel Chen,
Department Manager of the Inotera Defect
Team, ¡°We are very happy with
the ease with which we can create new
signatures. The speed and accuracy of
IDA signature recognition is very high
so it makes the defect engineer much more
productive, and allows us to optimize
the process more quickly.¡±
IDA is configured to communicate directly
with Inotera¡¯s MES System.
SiGlaz IDA software automatically
classifies defects associated with a spatial
signature. When the performance of the
software is compared to a human expert,
the average performance of classification
has been above 90%.
Victor Luu, SiGlaz President
and CEO said, ¡°We are very
pleased to have an opportunity to work
with Inotera to incorporate our SSA during
the process optimization phase of the
yield ramp. It allows us to experience
a wide range of permutations for each
signature type so that the signature libraries
can be optimized, as well as the process.
When the process is transferred to production,
the signature libraries will be very well
established and very accurate. When a
defect signature is recognized, IDA will
point the customer directly to the root
cause.¡±
About SiGlaz
SiGlaz is a privately held corporation that provides manufacturers of ICs, flat panel displays and other high precision products with intelligent software to increase productivity and yield. SiGlaz provides advanced image processing products and spatial signature analysis (SSA) software products that automatically analyze the large volumes of data that generated by inspection and metrology tools to determine the root cause of manufacturing problems in seconds.
About Inotera
Inotera Memories, Inc.
was incorporated on January 23rd, 2003.
Inotera is a joint venture between Qimonda
AG and Nanya Technology Corporation. Inotera's
production facilities have been designed
to manufacture high-density and high-performance
commodity DRAM ¨Dynamic Random Access
Memory products using state-of-the-art
trench technology. The combination of
Qimonda's (the former Memory Products
Group of Infineon Technologies) world
leading technology and Nanya's cost-efficiency
in mass production has resulted in an
innovative company that is highly productive,
highly competitive and at the leading
edge in the DRAM industry. |
IDA
Enterprise Edition includes additional
modules for large scale database management
and real-time process monitoring.
SANTA CLARA, Calif. –
March 26, 2008 – SiGlaz, a world
leader in defect spatial signature analysis
(SSA) software, today announced that its
initial installation of Intelligent Defect
Analysis (IDA) Enterprise Edition has
been accepted by Winbond Electronics Corporation,
a leading semiconductor manufacturer based
in Taiwan. IDA software automatically
analyzes the spatial distribution of defects
on the wafer, using its patented algorithms,
and notifies the user when it recognizes
a signature. Defect spatial signatures
may result from process excursions or
from failures in process equipment.
IDA Enterprise Edition,
which operates on a Microsoft Windows-based
server with .NET framework and web service
architecture, is compatible with all leading
database software, including Microsoft
SQL Server. It provides a fab-wide repository
for signature analysis results and the
ability to access those results in real
time and from remote locations. A new
IDA module, called Real Time Process Monitor,
allows the user to run concurrent process
control rules and generate alarms, refreshing
the data hourly, daily or weekly. Another
new module, called IDA Navigator, provides
trend analysis capability and ad hoc queries
of analysis results, and it allows the
user to build, set and save process control
rules and alarms.
“The Enterprise
Edition of IDA provides a major benefit
to our fab, in terms of analyzing large
volumes of production defect data,”
according to a Winbond spokesperson. “Not
only does IDA notify the engineer when
it identifies a defect signature, the
engineer can quickly access the IDA database
from any location and view all of the
data in the affected lots. In addition,
IDA Auto-Learn capability and Layer Repeater
Analysis enable us to identify new signatures
that were not previously trained into
the signature library.”
SiGlaz IDA software automatically
classifies defects associated with a spatial
signature. When the performance of the
software is compared to a human expert,
the average performance of classification
has been above 90%.
Victor Luu, SiGlaz President
and CEO said, “We are very excited
about our new software platform. IDA Enterprise
Edition provides an upgrade path for our
users to expand the utility and application
of SSA in the fab. This new platform will
be the foundation for other new SiGlaz
products in the development pipeline that
will soon allow users to correlate defect
signatures with electrical test results,
and then with other metrology data.”
About SiGlaz
SiGlaz is a privately held corporation that provides manufacturers of ICs, flat panel displays and other high precision products with intelligent software to increase productivity and yield. SiGlaz provides advanced image processing products and spatial signature analysis (SSA) software products that automatically analyze the large volumes of data that generated by inspection and metrology tools to determine the root cause of manufacturing problems in seconds.
About Winbond
Winbond Electronics Corp.
was founded in 1987 in Hsinchu Science
Park, Taiwan. The company owns the capabilities
of both IC design and manufacturing and
provides entire solutions to the customers.
Winbond focuses on the development of
four main product lines, including µC
& µC-based Consumer IC, Computer
Logic IC, Mobile RAM, and Flash Memory,
and it has built a solid foundation and
a strong reputation in the semiconductor
industry.
Winbond has over 4,000
employees worldwide and operates one 150mm
wafer fab and one 300mm wafer fab. Winbond
owns more than 2,500 patents worldwide
and has subsidiaries in the USA, China,
Israel, and Japan. For more information,
please visit: http://www.winbond.com
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SiGlaz
Intelligent Defect Analysis software makes
real-time production decisions in SMIC
Shanghai Fab
Santa Clara, CA (August
24, 2007) – SiGlaz, a leading provider
of spatial signature analysis software
to the semiconductor industry, announced
today that it has integrated its Intelligent
Defect Analysis (IDA) with the Manufacturing
Execution System (MES) at the Semiconductor
Manufacturing International Corporation
(SMIC) in Shanghai.
SiGlaz IDA software
automatically classifies defects associated
with a known spatial signature. When the
performance of the software is compared
to a human expert, the average performance
of classification at SMIC has been above
90%.
“We appreciate
the confidence that SMIC has shown in
SiGlaz software. Whenever a customer allows
an automated analysis tool to make production
decisions, it’s a strong indicator
of the confidence he has in the accuracy
of the analysis,” said Victor Luu,
President of SiGlaz. “It also shows
that the SiGlaz software can be integrated
with disparate environments. In this case,
the customer is using software from BEA
Systems.”
After a defect analysis
recipe has been optimized, SMIC deploys
the recipe to run in continuous monitoring
mode within the Fab in a 24 by 7 mode.
The recipe automatically connects to MES
and sends it messages when a yield loss
situation is encountered.
According to a spokesperson
for SMIC, “We initially selected
SiGlaz IDA software because of its accuracy
and flexibility. The performance results
to date and the ability to integrate it
with MES confirm that we made a good decision.”
SMIC has been successful
in implementing SiGlaz spatial signature
analysis software to automatically identify
and classify of defect signatures on semiconductor
wafers in a manufacturing environment.
SiGlaz’ IDA has been running continuously
and processing thousands of wafer maps
per day for three manufacturing fabs in
the Shanghai area. All maps are processed
within the prescribed two minutes to hold
a lot.
About SiGlaz
SiGlaz is a privately held corporation that provides manufacturers of ICs, flat panel displays and other high precision products with intelligent software to increase productivity and yield. SiGlaz provides advanced image processing products and spatial signature analysis (SSA) software products that automatically analyze the large volumes of data that generated by inspection and metrology tools to determine the root cause of manufacturing problems in seconds.
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Feedback
from SiGlaz customers to Microsoft Partner
Program noted key areas of technical competency
Santa Clara, CA (August
22, 2007) – SiGlaz, a leading provider
of spatial signature analysis software
to the semiconductor industry, announced
today that it has been accepted by the
Microsoft Partner Program as a Certified
Partner. This level of certification recognizes
SiGlaz technical competence in key areas
of software development and system integration,
including database management, business
intelligence, and business process and
integration solutions. The Microsoft Partner
program awards points to its development
partners, based in large part upon the
results obtained in survey taken by the
partner’s customers.
“We are very pleased
to be recognized as a Microsoft Certified
Partner,” said Victor Luu, President
of SiGlaz. “It provides a level
of technical credibility when a small
company like SiGlaz can achieve this type
of recognition, especially when it is
based upon feedback from its customers.”
SiGlaz’ Intelligent
Defect Analysis (IDA) software, which
is based on Microsoft .NET framework,
can be easily integrated into the fab’s
information system that handles defect
inspection results. The IDA software automatically
acquires inspection results files from
the production database and notifies fab
personnel when it identifies a defect
spatial signature. IDA analysis results
are stored into a data base and available
for report generation or trend analysis.
SiGlaz has also worked with customers
to customize solutions to integrate IDA
to the customer’s MES software and
to report analysis results on a web portal.
In addition, the company
has recently started marketing software
engineering services to semiconductor
equipment companies on an outsourcing
basis and believes that achieving Microsoft
Certified Partner status will significantly
help it to increase revenues in this area.
SiGlaz specializes in image processing
and automated data analysis.
About SiGlaz
SiGlaz is a privately held corporation that provides manufacturers of ICs, flat panel displays and other high precision products with intelligent software to increase productivity and yield. SiGlaz provides advanced image processing products and spatial signature analysis (SSA) software products that automatically analyze the large volumes of data that generated by inspection and metrology tools to determine the root cause of manufacturing problems in seconds.
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Advanced Signature Analyzer feature provides
significant improvements in object recognition.
SANTA CLARA, CA, March
02, 2007 - SiGlaz, a leading provider
of spatial signature analysis software
to the semiconductor industry, announced
the release of version 8.4 of its Intelligent
Defect Analysis (IDA) software. SiGlaz
IDA software provides a number of signature
recognition methodologies that can be
customized and optimized for a particular
signature and inspection step. The latest
release of the software includes an Advanced
Signature Analyzer function that builds
on the previous IDA object analyzer, adding
new functionality to improve both accuracy
and ease-of-use.
"Customers who have
evaluated the IDA Advanced Signature Analyzer
have found immediate applications for
the new functions," said John Poreda,
SiGlaz Vice President of Sales and Marketing.
"The new software features, like
Robust Line Function, Super Objects and
Pattern Matching, significantly extend
the flexibility of the object analyzer.
The new step-by-step user interface, which
includes a "Preview" button,
makes it much easier for the user to generate
the rules for the signature library."
IDA software defines
an object as a group of defects that lie
within a defined spatial proximity. Each
object may be characterized by attributes
that describe its size, shape, orientation
and location. An object signature is an
object whose attributes match a set of
rules defined by the user. When the defect
signature is characterized by a distinctive
shape, it is usually well-suited for object
signature analysis. A white paper describing
the SiGlaz Advanced Signature Analyzer
may be downloaded from the SiGlaz web
site.
IDA provides several
algorithms for recognizing spatial signatures,
including pattern matching, zonal analysis,
repeater analysis and object analysis.
The Advanced Signature Analyzer may be
used in conjunction with other these IDA
recognition algorithms to provide very
high levels of accuracy and purity.
About SiGlaz
SiGlaz is a privately held corporation that provides manufacturers of ICs, flat panel displays and other high precision products with intelligent software to increase productivity and yield. SiGlaz provides advanced image processing products and spatial signature analysis (SSA) software products that automatically analyze the large volumes of data that generated by inspection and metrology tools to determine the root cause of manufacturing problems in seconds.
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Ease of deployment and improved
yield noted as key benefits
SANTA CLARA, Calif.
– June 26, 2006 – SiGlaz,
a world leader in defect spatial signature
analysis (SSA) software, today announced
that its Intelligent Defect Analysis (IDA)
software to improve defect learning and
root cause analysis has been deployed
by UMC (NYSE: UMC, TSE: 2303), a leading
global semiconductor foundry.
Defect spatial signatures
may result from process excursions or
from failures in process equipment. The
large volumes of inspection data generated
by advanced semiconductor fabs make it
virtually impossible to manually review
all of the data in an efficient manner.
SiGlaz IDA software automatically analyzes
the spatial distribution of defects on
the wafer and notifies the user when it
recognizes a signature. Early identification
of a process excursion can translate to
yield improvement and cost reduction.
“The SiGlaz IDA
software has integrated easily into our
production environment and is proving
to be a useful tool,” said Mr. Sean
Lee, Manager for UMC Fab 8D. “As
SiGlaz’s software is designed to
notify engineering personnel shortly after
a problem occurs, IDA can reduce the time
required to address any potential issues
and in turn help increase productivity
and yield.”
SiGlaz IDA software may
be used to identify many types of spatial
signatures, such as scratches (curved
or linear), rings and blobs on single
wafers. Multiple wafers levels may be
stacked to enhance faint signatures; multiple
levels may also be analyzed for layer-to-layer
repeaters.
"UMC provides a
unique environment for identifying signatures
because of the large number of device
types and great varieties of processes
that flow through their facility,”
said SiGlaz President Victor Luu. “We
have worked closely with them to qualify
our software tools for use in production.
We’re very pleased with the role
our product plays in UMC’s yield
optimization strategy, and for their vote
of confidence to deploy our product.”
Note From UMC Concerning Forward-Looking
Statements
Some of the statements
in the foregoing announcement are forward
looking within the meaning of the U.S.
Federal Securities laws, including statements
about future outsourcing, wafer capacity,
technologies, business relationships and
market conditions. Investors are cautioned
that actual events and results could differ
materially from these statements as a
result of a variety of factors, including
conditions in the overall semiconductor
market and economy; acceptance and demand
for products from UMC; and technological
and development risks.
About
SiGlaz
SiGlaz is a privately held corporation that provides manufacturers of ICs, flat panel displays and other high precision products with intelligent software to increase productivity and yield. SiGlaz provides advanced image processing products and spatial signature analysis (SSA) software products that automatically analyze the large volumes of data that generated by inspection and metrology tools to determine the root cause of manufacturing problems in seconds.
About
UMC
UMC
(NYSE: UMC, TSE: 2303) is a leading global
semiconductor foundry that manufactures
advanced process ICs for applications
spanning every major sector of the semiconductor
industry. UMC delivers cutting-edge foundry
technologies that enable sophisticated
system-on-chip (SoC) designs, including
volume production 90nm, industry-leading
65nm, and mixed signal/RFCMOS. UMC’s
10 wafer manufacturing facilities include
two advanced 300mm fabs; Fab 12A in Taiwan
and Singapore-based Fab 12i are both in
volume production for a variety of customer
products. The company employs approximately
12,000 people worldwide and has offices
in Taiwan, Japan, Singapore, Europe, and
the United States. UMC can be found on
the web at http://www.umc.com. |
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Santa Clara, CA – November 14, 2005
– SiGlaz announced today that it
has signed an agreement with Scientech
Corporation of Taiwan to represent its
Intelligent Defect Analysis (IDA) product
in Taiwan, China and Singapore. IDA is
a spatial signature analysis (SSA) application
used by semiconductor manufacturers to
automatically monitor wafer inspection
results files in a production environment
and to identify signatures that are caused
by process excursions.
According to Victor Luu, SiGlaz President
and CEO, “SiGlaz has developed a
close working relationship with Scientech
over the past several months. Scientech
not only provides us with a very strong
sales and support infrastructure, they
are defining the technical requirements
that will enable us to become successful
in capturing a significant share of the
market in Taiwan and throughout Asia.”
Scientech Executive Vice President of
Sales, M.T. Hsu believes that SiGlaz’
IDA product is hitting the market at just
the right time. “Taiwanese customers
understand the value that an SSA product
can provide, in terms of improving root
cause analysis and ultimately improving
yields. IDA integrates easily into the
customer’s fab and it has demonstrated
excellent accuracy and throughput in customer
evaluations. In addition, the SiGlaz engineering
team has provided outstanding support
to enhance the product to address the
needs of our customers.”
SiGlaz IDA software is comprised of two
primary modules: Defect Signature Analyzer
(DSA), which allows the defect engineer
to develop the methodology to analyze
defect signatures in KLA results files;
and Automation Workbench (AWB), which
enables the engineer to generate an analysis
recipe and to automatically monitor and
analyze results files in production. SiGlaz
plans to enhance the IDA capability with
two additional modules: Real-Time Signature
Monitor and Intelligent Reporting System.
SiGlaz Corporation is a developer of image
analysis and spatial intelligence software
for process monitoring and advanced process
control.
Scientech is a distributor of equipment
and materials for the Semiconductor, LCD
and other high-tech industries. They offer
suppliers access to an extensive infrastructure
in Taiwan, Great China, Singapore and
U.S.A.
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