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INTELLIGENT DEFECT ANALYSIS OVERVIEW

SiGlaz’ Intelligent Defect Analysis (IDA™) software provides semiconductor fabs with an automatic excursion monitoring capability that integrates seamlessly into existing yield management architecture to provide immediate value-added functionality. IDA monitors inspection results files (KLAsRF) in production and automatically recognizes spatial defect signatures resulting from equipment failure and process excursions.

IDA is a Spatial Signature Analysis software, and it may be integrated into the fabrication process to identify concentrated defect signatures (e.g., scratches or micro-scratches) or to identify distributed defect signatures, such a those resulting from the failure of a process tool. The software integrates into the fab’s data base management and SPC system; it is compatible with advanced Microsoft .NET framework and XML format.

SiGlaz Software also provides engineering resources to customize the software for specific customer applications.

IDA DATA SHEET