SiGlaz’ Intelligent Defect Analysis
(IDA™) software provides semiconductor fabs with an automatic
excursion monitoring capability that integrates seamlessly into
existing yield management architecture to provide immediate value-added
functionality. IDA monitors inspection results files (KLAsRF) in
production and automatically recognizes spatial defect signatures
resulting from equipment failure and process excursions.
IDA is a Spatial Signature Analysis software,
and it may be integrated into the fabrication process to identify
concentrated defect signatures (e.g., scratches or micro-scratches)
or to identify distributed defect signatures, such a those resulting
from the failure of a process tool. The software integrates into
the fab’s data base management and SPC system; it is compatible
with advanced Microsoft .NET framework and XML format.
SiGlaz Software also provides engineering resources
to customize the software for specific customer applications.
